Electronic Potting Compound(silicone encapsulants)

1,Typical Application

It's mainly for High powered electronics encapsulation,DC/DC module and circuit board which requires heat dissipation and high temperature resistance.

It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

2、Product Feature
Electronic potting compound is a kind of low viscosity, Inherent flame resistance, two components (1:1mixing ratio)addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials ofPC(Poly-carbonate)、PP、ABS、PVC, etc. and metal materials.